IPC 9503 PDF

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IPC Moisture Sensitivity Classification for Non-IC Components. Content Provider Association Connecting Electronics Industries [IPC]. IPC, PWB Assembly Sol- dering Process Guideline for. Electronic Components. • IPC, Moisture Sensitiv- ity Classification for Non-IC. Components. and Use of Moisture/Reflow Sensitive Surface Mount Devices). This standard supersedes IPC Developed by ECA, IPC and JEDEC.

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Static generating materials should be avoided.

The packaging shall allow the polarity or part number markings to be visible for each device. Use of newsprint, excelsior, or loosed fill expanded polystyrene shall be avoided as a 950 of cushioning. Waffle pack covers will also consists of black static dissipative material.

With the notch of the waffle pack in the upper left hand corner, parts must be loaded left to right, and top to bottom. Use of newsprint, excelsior, or loosed fill expanded polystyrene is not allowed as a means of cushioning. Tray covers will also consists of black static dissipative material held to the base with a one piece clip. Waffle pack dimensions should jpc the same for subsequent lots of the same component type. This code shall only be used on product provided by through Integrated Supplier Ipf Agreements.

Each moisture barrier bag may contain up to 10 PWBs of size in2 per side or greater, and smaller boards may be packaged up to 25 per bag.

Packaging Requirement Codes

All waffle packs containing items that are ESD sensitive diodes, integrated circuits, etc. Parts do not have to be pre-oriented, but must be face up. Parts must be loaded consecutively from left to right, proceeding from top to bottom as viewed with the notch of the waffle pack positioned in the upper left hand corner with a consistent separation between ipf and columns. Items that are ESD sensitive ioc be individually, electrostatically protected using appropriate industrial practices. Matte finish waffle packs should be used if available.

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If there are any questions contact Microwave Manufacturing Engineering.

Preferred cavity depth should not exceed more than 20 mils above the top of the component. Once a Tray is chosen all components of that size for the entire P. Surface mount components shall be suitable for vacuum pick up, include caps as applicable. Tape and Reel Only General Requirements: If there are any questions contact Microwave Manufacturing Engineering 6.

A carrier that holds multiple components in a row. Moisture content prior to packaging shall not exceed 0.

Compliance Commitments related to the manufacture and. Elements or components that are Class 0 Sensitive shall be clearly marked as Class 0 on the external surface of the packaging.

Components will be covered with a lintfree filter paper insert s between the top of the component and the bottom cover. So typically paper as it enters the waste stream Tubes Only General Requirements: A maximum of 5 devices shall be contained in a tray.

Use of any static generating material is strictly prohibited. Specific packaging requirements will be provided by the using factory through the supplier electronic replenishment process. Oxide Sensitive devices shall be vacuum sealed in moisture proof antistatic material. Tubes for Surface-Mounted Components Definition: All the components shall be oriented in the same direction according to polarity or pin one markings.

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The carrier shall have removable stops on each end and shall prevent the components from shifting in any direction. Individual Comp Carrier General Requirements: The Gel retention level must be the minimum required to hold the component with a mesh size that adequately supports the component and allows the component to be released with vacuum applied.

Packaging Requirement Codes

Basin and Range Province PowerPoint. Items that are gold plated or have a 16 finish or lower shall contain the following note marked on exterior of container: The preferred cavity size should be mils.

Multiple boards in an MBB shall be separated by slip sheets or other appropriate materials such as pink poly bags. Suppliers should attempt to provide a best fit solution without incurring extensive tooling costs. The carrier shall be designed such that the component does not move when the carrier is opened and the lead configuration does not change once the component is removed from the carrier. Additional information on this requirement can be found at the following site: The parts must not be held in the pockets by supplementary means within the tray.

Items which are ESD sensitive shall be individually, electrostatically protected using appropriate industrial practices. Minimum cavity depth is the same height as 95503 of the component.